Biography

Hai Huang (Graduate Student Member, IEEE) received the B.Eng. degree in Internet of Things Engineering from Northeast Agricultural University, Harbin, China, in 2026. He is currently pursuing the M.S. degree in Robotics and Intelligent Systems at Nanyang Technological University, Singapore. He is also conducting research with the Singapore Institute of Manufacturing Technology (SIMTech), Agency for Science, Technology and Research (A*STAR). Previously, he was a Solutions Engineer Intern at the Digital Technology Center, China United Network Communications Group Co., Ltd. His research interests focus on Robot Learning and Manipulation.

I am currently looking for research collaboration and internship opportunities related to Force-aware Robot Learning, Robot Manipulation, and Vision-Language-Action Models.

Education

M.S. in Robotics and Intelligent Systems

08/2026 – Present

Nanyang Technological University

School of Mechanical and Aerospace Engineering

B.E. in Internet of Things

09/2022 – 06/2026

Northeast Agricultural University

College of Intelligent Science and Engineering

Experience

Research Attachment

08/2026 – Present

Singapore Institute of Manufacturing Technology (SIMTech), A*STAR

Singapore

Force-aware Robot LearningRobot Manipulation

Solutions Engineer Intern

07/2025 – 09/2025

China Unicom Chengdu Branch, Digital Technology Center

Chengdu, China

AI SolutionsIoT Solutions

News

  • [08/2026]
    MSM-Seg was accepted for publication as a regular paper in IEEE Transactions on Multimedia.
  • [08/2026]
    Began M.Sc. studies in Robotics and Intelligent Systems at Nanyang Technological University.
  • [07/2026]
    Completed an imitation-learning solution for the Marso Hack Berlin 2026 Robot Parcel Sorting Challenge.
  • [07/2026]
    Completed an end-to-end LeRobot imitation-learning pipeline on the SO-101 platform, including data collection, SmolVLA training, and real-robot evaluation.
  • [06/2026]
    Received the B.Eng. degree in Internet of Things Engineering from Northeast Agricultural University.
  • [09/2025]
    Completed an AI Solutions Engineer internship at China Unicom Chengdu Branch, Digital Technology Center.
  • [04/2024]
    Earned a silver medal in the Kaggle Home Credit - Credit Risk Model Stability competition, ranking in the top 0.5%.